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  • Cl2 ICP/Etching reactor

Cl2 ICP/Etching reactor

Computational conditions

Model
Model
  • Reference : M. Shiozawa and K. Nanbu,"Coupling of plasma and flow in materials processing", Thin Solid Films, Vol.457,pp.48-54,2004

Results

Electron density Electron temperature Plasma potential
Electron density Electron temperature Plasma potential
EEDF(Electron energy distribution function) Power deposition Azimuthal electric field
Electron energy distribution function Power deposition Azimuthal electric field E<sub>
Cl2(+)Ion density Cl(+)Ion density Cl(-)Ion density
Cl2(+)Ion density Cl(+)Ion density Cl(-)Ion density
Cl2 density Cl density
Cl2 density Cl density

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