Sputtering particles in DC magnetron sputtering equipment

Computational conditions

• Background gas Ar is uniformly distribution at 1mTorr, no flow field of Ar is assumed.
• Target material is Al. In this case, the sputtered particle flux and energy from the target are assumed as 1.0e18 [/m2/s] and 1 eV,respectively. But the sputtered particle flux, the angular distribution and energy of sputtered partciles are computed by PEGASUS/SPUTSM after plasma simulation by PEGASUS/PIC-MCC.

Results

	Al density distribution	Flux distribution on substrate
1 mTorr
	Al density distribution	Flux distribution on substrate
10 mTorr