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Planar magnetron sputtering sysmte

Computational conditions

Result

Magnetic flux density
Electron density
Electric potential
Ion flux

3D CCP plasma
Ion beam path calculation
Benard flow
Crossing flow of vertical board
Taylor-Couette flow
Flow field of wing edge
Unbalanced magnetron sputtering system
Planar magnetron sputtering sysmte
Coaxial cylinder magnetron
Analysis of a Magnetron Sputtering Equipment
DC magnetron sputtering equipment (1)
DC magnetron sputtering equipment (2)
3D calculation of a magnetron sputtering equipment
Self-ionized sputtering
Plasma parameter analysis in a RF magnetron sputtering equipment
Sputtering particle transfer in a DC magnetron sputtering equipment
Magnetic field analysis in a device having magnetic field coils
Magnetic field analysis in a magnetron sputtering device
Rarefied gas flow analysis in a CVD equipment with shower head structure
Validation (1) in CCP/GEC reactor.
Validation (2) in CCP/GEC reactor
Plasma calculation in a GEC Reference Cell type device
PIC-MCCM and DSMCM coupling calculation
SF6 ICP /Etching reactor
Cl2 ICP/Etching reactor
C2H2 ICP/CVD reactor
Discharge in a PDP cell
Comparison experiment and simulation for film thickness in vacuum evaporation equipment
Verification of vacuum evaporation film thickness distribution
Mixed gas simulation
Verification of Clausing's factor
Multi layer film PVD
Deposition and sputtering
SiO2 etching by Fluorocarbon plasma
Comparison of profile with solid SiO2 and porous SiO2
Si etching by Bosch process
Si etching by Ar/Cl2 plasma and comparison with FPSM2D
Orion atmospheric reentry simulation
Ar/Cl2 mixture gas flow
Flow around square cylinder
Flow field (Specular reflection)
Flow field (diffuse reflection)
SASAMAL calculation example
SMCSM calculation example

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