Cl2 ICP/Etching reactor
Computational conditions
Reference: M. Shiozawa and K. Nanbu,"Coupling of plasma and flow in materials processing", Thin Solid Films, Vol.457,pp.48-54,2004Result
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Electron density
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Electron temperature
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Electric potential
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EEDF (electron energy distribution function)
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Power deposition
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Azimuthal electric field
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Cl2(+) density
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Cl(+) density
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Cl(-) density
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Cl2 density
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Cl density