Sputtering particle transfer in a DC magnetron sputtering equipment
Computational conditions
- Background gas Ar is uniformly distribution at 1mTorr, no flow field of Ar is assumed.
- Target material is Al. In this case, the sputtered particle flux and energy from the target are assumed as 1.0e18 [/m2/s] and 1 eV,respectively. But the sputtered particle flux, the angular distribution and energy of sputtered partciles are computed by PEGASUS/SPUTSM after plasma simulation by PEGASUS/PIC-MCC.
Result
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1mTorr: Al density
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1mTorr: Fulux distribution on substrate
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10mTorr:Al density
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10mTorr: Flux distribution on substrate