Sputtering particle transfer in a DC magnetron sputtering equipment

Computational conditions

  • Background gas Ar is uniformly distribution at 1mTorr, no flow field of Ar is assumed.
  • Target material is Al. In this case, the sputtered particle flux and energy from the target are assumed as 1.0e18 [/m2/s] and 1 eV,respectively. But the sputtered particle flux, the angular distribution and energy of sputtered partciles are computed by PEGASUS/SPUTSM after plasma simulation by PEGASUS/PIC-MCC.

Result

  • 1mTorr: Al density

    1mTorr: Al density

  • 1mTorr: Fulux distribution on substrate

    1mTorr: Fulux distribution on substrate

  • 10mTorr:Al density

    10mTorr:Al density

  • 10mTorr: Flux distribution on substrate

    10mTorr: Flux distribution on substrate